| Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录) | |
| Zhou, Min-Bo[1]; Zeng, Jing-Bo[1]; Ma, Xiao[1]; Zhang, Xin-Ping[1] | |
| 会议名称 | 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2055330 |
| 专题 | 华南理工大学 |
| 作者单位 | S China Univ Technol, Sch Mat Sci & Engn, Guangzhou 510640, Guangdong, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhou, Min-Bo[1],Zeng, Jing-Bo[1],Ma, Xiao[1],等. Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录)[C]. 见:2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012). |
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