| Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu Joints (CPCI-S收录) | |
| Yue, Wu[1]; Zhou, Min-Bo[1]; Qin, Hong-Bo[1]; Ma, Xiao[1]; Zhang, Xin-Ping[1] | |
| 会议名称 | 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 关键词 | Electromigraiton Pre-existion void Cu/Sn58Bi/Cu solder joint Inhibittion effect Crack |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2051016 |
| 专题 | 华南理工大学 |
| 作者单位 | S China Univ Technol, Sch Mat Sci & Engn, Guangzhou 510640, Guangdong, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yue, Wu[1],Zhou, Min-Bo[1],Qin, Hong-Bo[1],等. Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu Joints (CPCI-S收录)[C]. 见:2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). |
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