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CORC

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ZeroScreen: A Novel Structure for IC Reliability Screening at Time-Zero 会议论文
2019 IEEE 37TH VLSI TEST SYMPOSIUM (VTS), 2019-01-01
作者:  Yu, Liting;  Wang, Xiaoxiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Detection of Single Event Transients based on Compressed Sensing 会议论文
Australia
作者:  Cuiping Shao ;   Huiyun Li
收藏  |  浏览/下载：18/0  |  提交时间：2018/02/02
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
High Temperature Reliability and Failure of W-based Microhotplates 会议论文
2015 IEEE SENSORS, 2015-11-01
作者:  Zhou, Junwei;  Yu, Jun;  Li, Zhongzhou;  Liu, Kaiqiang;  Tang, Zhenan
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Modeling and Simulation for the Thermo-mechanical Interfacial Reliability of Through-silicon-via for 3D IC Integration 会议论文
作者:  Jiang, Hao;  Cao, Gang;  Luo, Zhang;  Xu, Chunlin;  Li, Cao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Stochastic Wire-Length Model with TSV Placement on Periphery Area 会议论文
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, 新加坡
作者:  Ling, Jianhui;  Li, Huiyun;  Xu, Guoqing;  Xiong, Liying
收藏  |  浏览/下载：17/0  |  提交时间：2015/09/01
CAPACITY RELIABILITY ALGORITHM IN COMMUNICATION NETWORK BASED ON THE SHORTEST DELAY 会议论文
4th IEEE International Conference on Network Infrastructure and Digital Content (IEEE IC-NIDC), Beijing, PEOPLES R CHINA, 2014-09-19
作者:  Lee Dongpeng;  Huang Ning;  Liu Zhao
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06
Solving the Lower Reliability Confidence Limit of Binomial Distribution by Using Numeric Iteration Method 会议论文
International Conference on Materials, Mechanical and Manufacturing Engineering (IC3ME 2013), Guilin, PEOPLES R CHINA, 2014-01-01
作者:  Wan, Bo;  Fu, Guicui;  Dong, Yibing
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06

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