| Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs | |
| Yao, Mingjun; Zhao, Ning; Yu, Daquan; Xiao, Zhiyi; Ma, Haitao | |
| 2018 | |
| 会议名称 | 19th International Conference on Electronic Packaging Technology, ICEPT 2018 |
| 会议日期 | 2018-08-08 |
| 会议地点 | Shanghai, China |
| 页码 | 241-246 |
| 会议录 | 19th International Conference on Electronic Packaging Technology, ICEPT 2018
 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3234727 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.School of Materials Science and Engineering, Dalian University of Technology, Dalian, China 2.Huatian Technology Electronics Co., Kunshan, China |
| 推荐引用方式 GB/T 7714 | Yao, Mingjun,Zhao, Ning,Yu, Daquan,et al. Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs[C]. 见:19th International Conference on Electronic Packaging Technology, ICEPT 2018. Shanghai, China. 2018-08-08. |
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