QQ客服 官方微博 反馈留言

浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Falling-droplet-enhanced filmwise condensation in the presence of non-condensable gas 期刊论文 INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 卷号: 140, 页码: 173-186 作者:  Wen, Rongfu;  Zhou, Xingdong;  Peng, Benli;  Lan, Zhong;  Yang, Ronggui 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02 Condensation heat transfer  Non-condensable gas  Nucleation  Droplet dynamic  Diffusion boundary layer  Liquid film  Hybrid wettability   Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557 作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02 3D IC  micro-bump  B-stage adhesive film  wafer-level hybrid bonding  via-last TSVs   Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862 作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02 3-D IC  bump  dry film adhesive  wafer-level hybrid bonding   In situ synthesis of chemically active ZIF coordinated with electrospun fibrous film for heavy metal removal with a high flux 期刊论文 SEPARATION AND PURIFICATION TECHNOLOGY, 2017, 卷号: 177, 页码: 257-262 作者:  Wang, Gang;  Zhang, Hao;  Wang, Jianren;  Ling, Zheng;  Qiu, Jieshan 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02 Hybrid nanofibrous film  ZIF-8  Electrospun  Heavy metal removal   DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文 China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12 作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 Hybrid bonding  3D packaging  Bump  Polyimide  Dry film   Ag nanoparticles-TiO2 film hybrid for plasmon-exciton co-driven surface catalytic reactions 期刊论文 APPLIED MATERIALS TODAY, 2017, 卷号: 9, 页码: 251-258 作者:  Ding, Qianqian;  Li, Rui;  Chen, Maodu;  Sun, Mengtao 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03 Ag nanoparticles  TiO2 film  Hybrid  Plasmon-exciton coupling  Surface catalytic reactions   A hybrid ultrovilet detector based on polystyrene sulfate modified TiO2 nanocrystalline 期刊论文 SOLID STATE COMMUNICATIONS, 2017, 卷号: 262, 页码: 29-32 作者:  Zheng, Wenji;  Dong, Yanan;  Yan, Xiaoming;  Ding, Rui;  He, Gaohong 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09 TiO2 nanocrystalline film  Polystyrene sulfate  Hybrid detector  Responsivity   Multiobjective Hybrid Genetic Algorithms for Manufacturing Scheduling: Part II Case Studies of HDD and TFT-LCD 会议论文 9th International Conference on Management Science and Engineering Management (ICMSEM), Karlsruhe Inst Technol, Karlsruhe, GERMANY, 2015-07-21 作者:  Gen, Mitsuo;  Zhang, Wenqiang;  Lin, Lin 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/09 Hybrid genetic algorithms (HGA)  Multiobjective HGA (Mo-HGA)  Manufacturing scheduling  Flexible job-shop scheduling problem (FJSP)  Hard disc device (HDD)  Thin-film transistor-liquid crystal display (TFT-LCD)