DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP | |
Yao, Mingjun; Yu, Daquan; Zhao, Ning; Fan, Jun; Xiao, Zhiyi; Ma, Haitao | |
2017 | |
会议名称 | China Semiconductor Technology International Conference (CSTIC) |
会议日期 | 2017-03-12 |
会议地点 | Shanghai, PEOPLES R CHINA |
关键词 | Hybrid bonding 3D packaging Bump Polyimide Dry film |
页码 | - |
会议录 | China Semiconductor Technology International Conference (CSTIC) |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3285550 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian University of Technology, 116024, China 2.Huatian Technology Electronics Co., Ltd., 215300, China |
推荐引用方式 GB/T 7714 | Yao, Mingjun,Yu, Daquan,Zhao, Ning,et al. DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP[C]. 见:China Semiconductor Technology International Conference (CSTIC). Shanghai, PEOPLES R CHINA. 2017-03-12. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论