| Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps | |
| Yao, Mingjun; Zhao, Ning; Wang, Teng; Yu, Daquan; Xiao, Zhiyi; Ma, Haitao | |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 2018 | |
| 卷号 | 8页码:1855-1862 |
| 关键词 | 3-D IC bump dry film adhesive wafer-level hybrid bonding |
| ISSN号 | 2156-3950 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3258527 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yao, Mingjun,Zhao, Ning,Wang, Teng,et al. Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8:1855-1862. |
| APA | Yao, Mingjun,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,&Ma, Haitao.(2018).Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8,1855-1862. |
| MLA | Yao, Mingjun,et al."Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8(2018):1855-1862. |
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