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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer 期刊论文 JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2018, 卷号: 140 作者:  Lin, Bin;  Zhou, Ping;  Wang, Ziguang;  Yan, Ying;  Kang, Renke 收藏  |  浏览/下载：12/0  |  提交时间：2019/12/02 ultrafine grinding  grain depth-of-cut  cutting tip radius  analytical model  elastic-plastic deformation   Research on Microscopic Grain-workpiece Interaction in Grinding through Micro-cutting Simulation, part 2: Factorial Study 期刊论文 ADVANCES IN ABRASIVE TECHNOLOGY XII, 2009, 卷号: 76-78, 页码: 15-20 作者:  Yan, Lan;  Li, Xuekun;  Jiang, Feng;  Zhou, Zhixiong;  Rong, Yiming 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/26 single grain cutting  finite element method (FEM)  (specific) cutting  force  material removal rate  critical depth of cut  shear angle   A method for grinding mode identification in grinding of silicon wafers 会议论文 9th International Symposium on Precision Surface Finishing and Deburring Technology, Suzhou, PEOPLES R CHINA, 2007-01-01 作者:  Huo, F. W.;  Jin, Z. J.;  Kang, R. K.;  Guo, D. M. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27 silicon wafers  ductile mode grinding  median cracks  surface topography  maximum valley  grain depth of cut   Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 2: Factorial Study 会议论文 Advanced Materials Research, 15-20, 2009 作者:  Yan, L;  Li, XK;  Jiang, F;  Zhou, ZX;  Rong, YM ) 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/13 Critical Depth of Cut  Finite Element Model (FEM)  Material Removal Rate (MRR)  Shear Angle  Single Grain Cutting  Specific Cutting Force