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A method for grinding mode identification in grinding of silicon wafers
Huo, F. W.; Jin, Z. J.; Kang, R. K.; Guo, D. M.
2007
会议名称9th International Symposium on Precision Surface Finishing and Deburring Technology
会议日期2007-01-01
会议地点Suzhou, PEOPLES R CHINA
关键词silicon wafers ductile mode grinding median cracks surface topography maximum valley grain depth of cut
页码255-260
会议录9th International Symposium on Precision Surface Finishing and Deburring Technology
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5670656
专题大连理工大学
作者单位Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116024, Peoples R China.
推荐引用方式
GB/T 7714
Huo, F. W.,Jin, Z. J.,Kang, R. K.,et al. A method for grinding mode identification in grinding of silicon wafers[C]. 见:9th International Symposium on Precision Surface Finishing and Deburring Technology. Suzhou, PEOPLES R CHINA. 2007-01-01.
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