A method for grinding mode identification in grinding of silicon wafers | |
Huo, F. W.; Jin, Z. J.; Kang, R. K.; Guo, D. M. | |
2007 | |
会议名称 | 9th International Symposium on Precision Surface Finishing and Deburring Technology |
会议日期 | 2007-01-01 |
会议地点 | Suzhou, PEOPLES R CHINA |
关键词 | silicon wafers ductile mode grinding median cracks surface topography maximum valley grain depth of cut |
页码 | 255-260 |
会议录 | 9th International Symposium on Precision Surface Finishing and Deburring Technology
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URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5670656 |
专题 | 大连理工大学 |
作者单位 | Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116024, Peoples R China. |
推荐引用方式 GB/T 7714 | Huo, F. W.,Jin, Z. J.,Kang, R. K.,et al. A method for grinding mode identification in grinding of silicon wafers[C]. 见:9th International Symposium on Precision Surface Finishing and Deburring Technology. Suzhou, PEOPLES R CHINA. 2007-01-01. |
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