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	Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
	Lin, Bin; Zhou, Ping; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming
刊名	JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
	2018
卷号	140
关键词	ultrafine grinding grain depth-of-cut cutting tip radius analytical model elastic-plastic deformation
ISSN号	1087-1357
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3254281
专题	大连理工大学
作者单位	Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Lin, Bin,Zhou, Ping,Wang, Ziguang,et al. Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer[J]. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2018,140.
APA	Lin, Bin,Zhou, Ping,Wang, Ziguang,Yan, Ying,Kang, Renke,&Guo, Dongming.(2018).Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer.JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,140.
MLA	Lin, Bin,et al."Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer".JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME 140(2018).

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