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CORC

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Controlled Growth of Wafer-Scale Transition Metal Dichalcogenides with a Vertical Composition Gradient for Artificial Synapses with High Linearity 期刊论文
ACS NANO, 2022, 卷号: 16, 期号: 8, 页码: 12318-12327
作者:  Tang, Lei;  Teng, Changjiu;  Xu, Runzhang;  Zhang, Zehao;  Khan, Usman
收藏  |  浏览/下载：19/0  |  提交时间：2022/10/08
Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays 期刊论文
ADVANCED MATERIALS, 2022, 页码: 8
作者:  Li, Bo;  Zhu, Qian-Bing;  Cui, Cong;  Liu, Chi;  Wang, Zuo-Hua
收藏  |  浏览/下载：27/0  |  提交时间：2022/07/01
Impact of TID on Within-Wafer Variability of Radiation-Hardened SOI Wafers 期刊论文
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2021, 卷号: 68, 期号: 7, 页码: 1423-1429
作者:  Zheng, QW (Zheng, Qiwen) 1;  Cui, JW (Cui, Jiangwei) 1;  Yu, XF (Yu, Xuefeng) 1;  Li, YD (Li, Yudong) 1;  Lu, W (Lu, Wu) 1
收藏  |  浏览/下载：43/0  |  提交时间：2021/08/06
Research on ultra-smooth collimation separation of silicon wafer by multiple lasers 会议论文
Suzhou, China, 2020-05-01
作者:  Youwang, Hu;  Ming, Li;  Qinqin, Xie;  Xiaoyan, Sun
收藏  |  浏览/下载：9/0  |  提交时间：2020/07/28
A scalable polymer-free method for transferring graphene onto arbitrary surfaces 期刊论文
CARBON, 2020, 卷号: 161, 页码: 479-485
作者:  Zhang, Xuewei;  Xu, Chen;  Zou, Zhenxing;  Wu, Zehao;  Yin, Shaoqian
收藏  |  浏览/下载：11/0  |  提交时间：2020/12/16
Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints 期刊论文
IEEE/CAA Journal of Automatica Sinica, 2020, 卷号: 7, 期号: 3, 页码: 776-789
作者:  Jipeng Wang;  Hesuan Hu;  Chunrong Pan;  Yuan Zhou;  Liang Li
收藏  |  浏览/下载：15/0  |  提交时间：2021/03/11
Wafer-level fabrication of low power consumption integrated alcohol microsensor 期刊论文
MICRO & NANO LETTERS, 2019, 卷号: 14, 页码: 11-16
作者:  Wang, Hairong;  Wang, Mengya;  Lei, Weitao;  Chen, Xiaowei;  Huang, Hao
收藏  |  浏览/下载：28/0  |  提交时间：2019/11/19
Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle 期刊论文
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2019, 卷号: 16, 页码: 668-677
作者:  Liu, Dong;  Teo, Chek Sing;  Liang, Wenyu;  Tan, Kok Kiong
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm 期刊论文
SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, 2019, 卷号: 7
作者:  Pan, Tingting;  Yang, Jie;  Wu, Wei;  Dung, Zhigang;  Ayinde, Babajide O.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Influence of rapid thermal annealing on the wafer warpage in 3D NAND flash memory 期刊论文
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2019, 卷号: Vol.34 No.2
作者:  Li, Qi;  Zhang, Yu;  Zou, Xingqi;  Gao, Jing;  Yang, Chuan
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/13

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