Research on ultra-smooth collimation separation of silicon wafer by multiple lasers

doi:10.1109/ICEDME50972.2020.00109

CORC > 西安光学精密机械研究所 > 中国科学院西安光学精密机械研究所 > 瞬态光学技术国家重点实验室

	Research on ultra-smooth collimation separation of silicon wafer by multiple lasers
	Youwang, Hu 2; Ming, Li 1; Qinqin, Xie 2; Xiaoyan, Sun 2
	2020-05
会议日期	2020-05-01
会议地点	Suzhou, China
关键词	silicon wafer laser thermal cracking prefabricated crack
DOI	10.1109/ICEDME50972.2020.00109
页码	454-457
英文摘要	Micro-cracks are prefabricated on the surface of the silicon wafer, and laser thermal cracking is used to dice the silicon wafer, which can greatly reduce the surface roughness of the cross section of the wafer, improve the straightness after cutting, and achieve high-quality dicing of silicon wafers. This is a new dicing technology with huge application value. © 2020 IEEE.
产权排序	2
会议录	Proceedings - 2020 3rd International Conference on Electron Device and Mechanical Engineering, ICEDME 2020
会议录出版者	Institute of Electrical and Electronics Engineers Inc.
语种	英语
ISBN号	9781728181455
内容类型	会议论文
源URL	[http://ir.opt.ac.cn/handle/181661/93591]
专题	西安光学精密机械研究所_瞬态光学技术国家重点实验室
通讯作者	Xiaoyan, Sun
作者单位	1.Xi'An Institute of Optics and Precision Mechanics of CAS, State Key Laboratory of Transient Optics and Photonics, Xi'an, Shanxi; 710119, China 2.Central South University, State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Changsha, China;
推荐引用方式 GB/T 7714	Youwang, Hu,Ming, Li,Qinqin, Xie,et al. Research on ultra-smooth collimation separation of silicon wafer by multiple lasers[C]. 见:. Suzhou, China. 2020-05-01.