| Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle | |
| Liu, Dong; Teo, Chek Sing; Liang, Wenyu; Tan, Kok Kiong | |
| 刊名 | IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING
 |
| 2019 | |
| 卷号 | 16页码:668-677 |
| 关键词 | Distributed Bernoulli principle noncontact soft gripping ultrathin wafer |
| ISSN号 | 1545-5955 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3219336 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore. 2.Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China. 3.Singapore Inst Mfg Technol, Mechatron Grp, Singapore 138634, Singapore. 4.Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore. |
| 推荐引用方式 GB/T 7714 | Liu, Dong,Teo, Chek Sing,Liang, Wenyu,et al. Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle[J]. IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING,2019,16:668-677. |
| APA | Liu, Dong,Teo, Chek Sing,Liang, Wenyu,&Tan, Kok Kiong.(2019).Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle.IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING,16,668-677. |
| MLA | Liu, Dong,et al."Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle".IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING 16(2019):668-677. |
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