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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Binary alloys  Brazing  Copper compounds  Diffusion  Dissolution  Intermetallics  Lead-free solders  Phase interfaces  Tin alloys  Tin compounds  Cu-Sn intermetallics  Dissolution model  Evolution of the microstructure  Formation and evolutions  Formation mechanism  Planar shape  Soldering process  Solid-liquid interfaces   Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   Recent development of electronic packaging technology 期刊论文 2010, 2010 Fu Yuepeng; Tan Kai; Tian Minbo 收藏  |  浏览/下载：4/0 无铅焊接表面贴装工艺研究 学位论文 2009, 2009 柳坚 收藏  |  浏览/下载：2/0  |  提交时间：2016/02/14 无铅焊接  表面贴装技术  工艺  Lead-free soldering  Surface Mount Technology  Process   Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录) 会议 作者:  Tan, Meng-Ying;  Zhou, Min-Bo;  Huang, Lia-Qiang;  Ma, Fa-Qian;  Ma, Xiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 surface defect  solder ball spattering  Sn-Bi solder paste  reflow soldering process   Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议 作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Aluminum solder paste  reflow process  soldering parameter  reliability