QQ客服 官方微博 反馈留言

	Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录)
	Tan, Meng-Ying; Zhou, Min-Bo; Huang, Lia-Qiang; Ma, Fa-Qian; Ma, Xiao; Zhang, Xin-Ping[1]
关键词	surface defect solder ball spattering Sn-Bi solder paste reflow soldering process
URL标识	查看原文
内容类型	会议
URI标识	http://www.corc.org.cn/handle/1471x/2039879
专题	华南理工大学
推荐引用方式 GB/T 7714	Tan, Meng-Ying,Zhou, Min-Bo,Huang, Lia-Qiang,等.Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录).

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。