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华南理工大学 [21]

兰州理工大学 [18]

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	The role of ERNi-1 wire on microstructure and properties of pure nickel N6 plasma arc welding joint 期刊论文 Materials Research, 2021, 卷号: 24, 期号: 1 作者: Chai, Ting Xing; Zhang, Liang Liang; Wang, Xi Jing; Xu, Hong Tong 收藏 \| 浏览/下载：7/0 \| 提交时间：2021/04/12 Alumina Aluminum Aluminum oxide Austenite Carbon monoxide Corrosion rate Crystallization Electric welding Filler metals Fillers Grain boundaries Grain size and shape Nickel Nitrogen fixation Nucleation Oxide minerals Soldered joints Tensile strength Textures Titanium Titanium dioxide Titanium nitride Welds Wire Austenite grain boundaries Heterogeneous nucleation Microstructure and properties Nitrogen porosities Plasma arc welding (PAW) Single phase austenite Structure and performance Welding thermal cycles
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Effect of Compression on Microstructure and Properties of Single Crystal Copper Cold Pressure Welding Joints 期刊论文 Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 12, 页码: 12110-12114 作者: Huang, Yong; Ran, Xiaolong; Yan, Xiaojuan 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Copper Crystal orientation Deformation Microstructure Pressure welding Soldered joints Tensile strength Cold pressure welding Deformation region Electrical conductivity High purity copper Joint microstructures Microstructure and properties Recrystallized grains Single crystal copper
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：9/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Reliable life prediction of rubber concrete based on temperature cycle degradation model 期刊论文 Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), 2020, 卷号: 48, 期号: 2, 页码: 42-46 作者: Chen, Kefan; Qiao, Hongxia; Wang, Penghui; Peng, Kuan 收藏 \| 浏览/下载：9/0 \| 提交时间：2020/11/14 Deterioration Elastic moduli Reliability Soldered joints Testing Accelerated life tests Acceleration factors Best linear unbiased estimation Reliability functions Rubber concrete
	Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者: Wang, Haozhong; Hu, Xiaowu; Li, Qinglin; Qu, Min 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 Binary alloys Coarsening Copper Growth rate Morphology Nanoparticles Rate constants Soldered joints Tin alloys Aging time Cu substrate IMC layer Inhibition effect Isothermal aging Lead-free solder joint Nanoparticle (NPs) Solder joints
	Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin; Zhou, Liuru 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Binary alloys Geometry Intermetallics Lead-free solders Morphology Polychlorinated biphenyls Silver compounds Soldered joints Tin alloys Aging time Compressive strain Enhanced effects Growth of intermetallics Kirkendall void Mean diameter Polyhedron shapes Solder joints
	Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者: Huang, Ru; Ma, Haoran; Shang, Shengyan; Kunwar, Anil; Wang, Yunpeng 收藏 \| 浏览/下载：26/0 \| 提交时间：2019/12/02 Chip scale packages Copper Copper alloys Flip chip devices Grain boundaries Growth rate Size determination Soldered joints Substrates Tin alloys, Electronic product Grain boundary motions Interface reactions Lateral growth rates Longitudinal growth Packaging process Packaging technologies Solder composition, Soldering
	Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文 Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60 作者: Zhao, F.; Qiu, Y.; Jia, F.; Ma, H. 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/12/30 Ball grid arrays Chip scale packages Fatigue damage Soldered joints Stress analysis Thermal cycling Thermal stress Vibration analysis Coffin-Manson equation Electronic Packaging Fatigue lifetime Incremental damage superposition approach Plastic ball grid array packages Temperature environments Unified viscoplasticity Vibration loading Thermal fatigue
	Effect of thermal cycles on the laser beam welded joint of AA2060 alloys 期刊论文 JOURNAL OF MATERIALS RESEARCH, 2018, 卷号: 33, 页码: 3439-3448 作者: Mao, Ling; Jin, Huijin; Ye, Fan; Wang, Feifei; Zheng, Gang 收藏 \| 浏览/下载：8/0 \| 提交时间：2019/12/30 Alloying Aluminum Heat affected zone Laser beam effects Laser beams Lithium alloys Microhardness Microstructure Soldered joints Strengthening (metal) Tensile strength Thermal cycling Welding Aging treatment Equiaxed zone Microstructure and mechanical properties Non-dendrite Re-precipitation Strengthening effect Strengthening phasis Thermal cycling treatment Aluminum alloys

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