CORC

浏览/检索结果: 共11条,第1-10条 帮助

已选(0)清除 条数/页:   排序方式:
Structure, Variation, and Co-occurrence of Soil Microbial Communities in Abandoned Sites of a Rare Earth Elements Mine (EI收录) 期刊论文
Environmental Science and Technology, 2016, 卷号: 50, 页码: 11481-11490
作者:  Chao, Yuanqing[1,2];  Liu, Wenshen[1];  Chen, Yanmei[1];  Chen, Wenhui[1];  Zhao, Lihua[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/24
The Study of Femtosecond Laser Irradiation on GaAs Solar Cells With TiO2/SiO2 Anti-Reflection Films 会议论文
International Conference on Applied Mechanics, Mechatronics and Intelligent Systems (AMMIS), 2016-01-01
作者:  Hua Yinqun[1];  Shi Zhiguo[2];  Wu Wenhui[3];  Chen Ruifang[4];  Rong Zhen[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/24
The Study of Femtosecond Laser Irradiation on GaAs Solar Cells With TiO2/SiO2 Anti-Reflection Films 会议论文
PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON APPLIED MECHANICS, MECHATRONICS AND INTELLIGENT SYSTEMS (AMMIS2015)
作者:  Hua Yinqun[1];  Shi Zhiguo[2];  Wu Wenhui[3];  Chen Ruifang[4];  Rong Zhen[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/24
Long-term clinical efficacy and safety of adding cilostazol to dual antiplatelet therapy after drug-eluting stent implantation in coronary arteries: A meta-analysis of randomized controlled trials 期刊论文
2015, 卷号: 136, 期号: 5, 页码: 870
作者:  Zou, Yandun[1,2];  Hu, Chunling[2];  Ye, Wenhui[2];  Fan, Limei[2];  Xu, Likun[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/06
Surface oxide analysis of lead-free solder particles 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 卷号: 25, 页码: 39-44
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Jackson, Gavin[5]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/30
The impact of symbolic power on information systems adoption: A bourdieusian perspective 期刊论文
2013, 卷号: 13, 期号: 15, 页码: 2940
作者:  Wang, Huifen[1];  Ye, Wenhui[1,2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/10
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Gavin, Jackson[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30
Influence of substrate on electrical conductivity of isotropic conductive adhesive 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Hu, Zhili[1];  Du, Wenhui[2];  Yue, Cong[3];  Ye, Lilei[4];  Yuan, Zhichao[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30
Study on the Reliability of Fast Curing Isotropic Conductive Adhesive 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/30
Study into High Temperature Reliability of Isotropic Conductive Adhesive 会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30


©版权所有 ©2017 CSpace - Powered by CSpace