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	Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM
	Luo, Xin[1]; Du, Wenhui[2]; Lu, Xiuzhen[3]; Yamaguchi, Toshikazu[4]; Gavin, Jackson[5]; Ye, Li Lei[6]; Liu, Johan[7]
	2011
会议名称	2011 International Symposium on Advanced Packaging Materials, APM 2011
会议日期	2011-10-25
页码	73-79
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2306752
专题	上海大学
作者单位	[1]Key Laboratory of New Displays and System Integration, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China |BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden [2]BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden [3]BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden [4]Henkel Technologies, United Kingdom [5]Henkel Technologies, United Kingdom [6]SHT Smart High Tech. AB, Fysikgr?nd 3, Se-412 96 G?teborg, Sweden[7]Key Laboratory of New Displays and System Integration, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China |BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden
推荐引用方式 GB/T 7714	Luo, Xin[1],Du, Wenhui[2],Lu, Xiuzhen[3],et al. Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM[C]. 见:2011 International Symposium on Advanced Packaging Materials, APM 2011. 2011-10-25.

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