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浏览/检索结果: 共6条，第1-6条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV) 会议论文 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015-01-01 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 Through-Silicon Vias (TSV)  stress  infrared photoelasticity  finite element analysis  hybrid method   The effect of stress on the mean time to failure (MTTF) of solder under electromigration 会议论文 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015-01-01 作者:  Pan, Xiaoxu;  Lan, Tianbao;  Su, Fei 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06 electromigration  electronic packaging  tensile and compressive stress  reliability   Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis 期刊论文 OPTICS AND LASERS IN ENGINEERING, 2015, 卷号: 74, 页码: 87-93 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06 Through-silicon vias (TSV)  Stress  Infrared photoelasticity  Finite element analysis  Hybrid method   Experimental and Finite Elemental Investigations on Residual Stress of TSV 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014-01-01 作者:  Su, Fei;  Lan, Tianbao;  Zhu, Yunhui;  Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06 Through Silicon Via (TSV)  Stress  Photo-elasticity  Finite element method   Thermo-mechanical Reliability of 3D package under different thermal cycling 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014-01-01 作者:  Lan, Tianbao;  Su, Fei 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 three-dimensional package  finite element  solder joint  fatigue life   High expression of liver histone deacetylase 3 contributes to high-fat-diet-induced metabolic syndrome by suppressing the PPAR-gamma and LXR-alpha-pathways in E3 rats 期刊论文 MOLECULAR AND CELLULAR ENDOCRINOLOGY, 2011, 卷号: 344, 期号: [db:dc_citation_issue], 页码: 69-80 作者:  Li, Dongmin;  Wang, Xuan;  Ren, Wuchao;  Ren, Juan;  Lan, Xi 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/10 Peroxisome proliferator activated receptor gamma  DA.1U rat  Histone deacetylase 3  E3 rat  Metabolic syndrome  Liver X receptor alpha