| Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV) | |
| Su, Fei; Lan, Tianbao; Pan, Xiaoxu; Zhang, Zheng | |
| 2015 | |
| 会议名称 | 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) |
| 会议日期 | 2015-01-01 |
| 关键词 | Through-Silicon Vias (TSV) stress infrared photoelasticity finite element analysis hybrid method |
| 卷号 | 2015-July |
| 页码 | 1789-1794 |
| 收录类别 | EI ; CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000370285100279 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6536398 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Su, Fei,Lan, Tianbao,Pan, Xiaoxu,et al. Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV)[C]. 见:2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). 2015-01-01. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论