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浏览/检索结果: 共11条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Genome-wide association study of glioma and meta-analysis 期刊论文 Human Genetics, 2012, 卷号: 131, 期号: 12 作者:  Rajaraman, Preetha/55916530900[0];  Melin, Beatrice S./36008926800[1];  Wang, Zhaoming/35346086300[2];  McKean-Cowdin, Roberta/6602742787[3];  Michaud, Dominique S./35292873800[4] 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/19 Effect of corrosion on the low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints 期刊论文 INTERNATIONAL JOURNAL OF FATIGUE, 2008, 卷号: 30, 页码: 917-930 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06 corrosion  lead-free  solder  low cycle fatigue   Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints 期刊论文 Microelectronics Reliability, 2007, 卷号: 47, 页码: 266-272 作者:  Andersson, C.[1];  Andersson, D.R.[2];  Tegehall, P.E.[3];  Liu, J.[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Andersson, C.[1];  Liu, L.[2];  Liu, J.[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/05/10 Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Andersson, C.[1];  Liu, L.[2];  Liu, J.[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Andersson, C.[1];  Liu, J.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Andersson, C.[1];  Liu, L.[2];  Liu, J.[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Isothermal low cycle fatigue behavior of Sn-8Zn-3Bi on single shear solder joint 会议论文 55th Electronic Components and Technology Conference, ECTC, 2005-05-31 作者:  Sun, P[1];  Andersson, C[2];  Cao, LQ[3];  Lai, ZH[4];  Cheng, ZN[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10