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	Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions
	Andersson, C.[1]; Liu, J.[2]
	2007
会议名称	ESTC 2006 - 1st Electronics Systemintegration Technology Conference
会议日期	2006-09-05
页码	457-467
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2384826
专题	上海大学
作者单位	[1]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden [2]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden |Key State Lab for New Displays and System Applicatons, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China
推荐引用方式 GB/T 7714	Andersson, C.[1],Liu, J.[2]. Low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints in different corrosive environmental conditions[C]. 见:ESTC 2006 - 1st Electronics Systemintegration Technology Conference. 2006-09-05.

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