Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy | |
Andersson, C.[1]; Liu, L.[2]; Liu, J.[3] | |
2007 | |
会议名称 | ESTC 2006 - 1st Electronics Systemintegration Technology Conference |
会议日期 | 2006-09-05 |
页码 | 152-160 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2384794 |
专题 | 上海大学 |
作者单位 | [1]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden [2]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden [3]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden |Key State Lab. for New Displays and System Applicatons, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China |
推荐引用方式 GB/T 7714 | Andersson, C.[1],Liu, L.[2],Liu, J.[3]. Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy[C]. 见:ESTC 2006 - 1st Electronics Systemintegration Technology Conference. 2006-09-05. |
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