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Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载:44/0  |  提交时间:2017/01/15
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载:5/0  |  提交时间:2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他
2016-01-01
Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology 期刊论文
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2016
Ma, Shenglin; Xia, Yanming; Wang, Yaohua; Ren, Kuili; Luo, Rongfeng; Song, Lu; Chen, Xian; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/04
阿格列汀治疗2型糖尿病的有效性与安全性中国大陆多中心、随机、双盲、安慰剂对照Ⅲ期临床研究 期刊论文
中华内科杂志, 2015, 卷号: 54, 期号: 11
作者:  潘长玉;  李文慧;  曾姣娥;  李成江;  杨金奎
收藏  |  浏览/下载:11/0  |  提交时间:2019/12/04
阿格列汀治疗2型糖尿病的有效性与安全性中国大陆多中心、随机、双盲、安慰剂对照Ⅲ期临床研究 期刊论文
2015, 卷号: 54, 期号: 11, 页码: 949-953
作者:  潘长玉;  李文慧;  曾姣娥;  李成江;  杨金奎
收藏  |  浏览/下载:11/0  |  提交时间:2020/01/04
Design, Fabrication and Stress Evaluation of Si Electrical Interconnection Air-gapped from Si Interposer 会议论文
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015-01-01
作者:  Ma, Shenglin;  Xia, Yanming;  Luo, Rongfeng;  Ren, Kuili;  Chen, Jing
收藏  |  浏览/下载:3/0  |  提交时间:2020/01/06
阿格列汀治疗2型糖尿病有效性和安全性Ⅲ期临床研究试验设计和中国大陆基线情况 期刊论文
中华内科杂志, 2013, 卷号: 52, 期号: 11
作者:  潘长玉;  李文慧;  曾姣娥;  李成江;  杨金奎
收藏  |  浏览/下载:11/0  |  提交时间:2019/12/04


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