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	Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer
	Xia, Yanming ; Ren, Kuili ; Ma, Shenglin ; Guan, Yong ; Cai, Han ; Luo, Rongfeng ; Yan, Jun ; Chen, Jing ; Jin, Yufeng
	2016
关键词	petaloid hollow Cu interconnection 3D TSV interposer thermal-mechanical simulation influence on electrical property
英文摘要	In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by thermalmechanical model. Typical electrical path composed of petaloid hollow Cu interconnection is modeled, coupling influences of structure changing and thermal vibration on its electrical property is analyzed.; CPCI-S(ISTP); mashenglin@xmu.edu.cn; 1033-1036
语种	英语
出处	17th International Conference on Electronic Packaging Technology (ICEPT)
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/459916]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Xia, Yanming,Ren, Kuili,Ma, Shenglin,et al. Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer. 2016-01-01.

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