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Neutron-induced single event upset simulation in Geant4 for three-dimensional die-stacked SRAM*
期刊论文
CHINESE PHYSICS B, 2021, 卷号: 30, 期号: 3, 页码: 8
作者:
Mo, Li-Hua
;
Ye, Bing
;
Liu, Jie
;
Luo, Jie
;
Sun, You-Mei
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2021/12/10
neutron
three-dimension ICs
single event upset
multi-bit upset
Geant4
LC Low-pass filter based on through-silicon via
会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/20
low-pass filter
through-silicon via (TSV)
three-dimensional integrated circuits (3-D IC)
A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC
会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:
Wang, Fengjuan
;
Li, Yue
;
Yu, Ningmei
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/20
three-dimensional integrated circuits (3-D IC)
thermal through-silicon via (TTSV)
redistribution layer (RDL)
heat-dissipation
An Effective Method of Reducing TSV Thermal Stress by STI
会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:
Wang, Fengjuan
;
Qu, Xiaoqing
;
Yu, Ningmei
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/20
Keywords Three-dimensional integrated circuits (3-D IC)
through-silicon via (TSV)
shallow trench isolation (STI)
thermal stress
keep-out zone (KOZ)
Materials, processing and reliability of low temperature bonding in 3D chip stacking
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:
Zhang, L
;
Liu, ZQ
;
Chen, SW
;
Wang, YD
;
Long, WM
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  |  
浏览/下载:24/0
  |  
提交时间:2018/12/25
3D IC
Low temperature bonding
Bonding method
Reliability
Materials, processing and reliability of low temperature bonding in 3D chip stacking
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:
Zhang, Liang
;
Liu, Zhi-quan
;
Chen, Sinn-Wen
;
Wang, Yao-dong
;
Long, Wei-Min
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2021/02/02
3D IC
Low temperature bonding
Bonding method
Reliability
A low-pass filter made up of the cylindrical through-silicon-via
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Wang, Fengjuan
;
Huang, Jia
;
Yu, Ningmei
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/20
Three-dimensional integrated circuits (3D IC)
through-silicon-via (TSV)
low-pass filter
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration
会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:
Liu, Huan
;
Zeng, Qinghua
;
Guan, Yong
;
Fang, Runiu
;
Sun, Xin
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip scale packages
Electronics packaging
Failure (mechanical)
Fatigue of materials
Finite element method
Shear stress
Soldering
Stresses
Thermal load
Timing circuits
Global simulation
Interfacial failures
Load condition
Maximum principal stress
Resistance measurement
Solder balls
Thermal mechanical stress
Thermal-mechanical reliability
Three dimensional integrated circuits
SEU Reliability Evaluation of 3D ICs
期刊论文
Electronics Letters, 2015
作者:
Huiyun Li
;
Xiaobo Hu
;
Cuiping Shao
;
Jianbin Zhou
;
Guoqing Xu
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2016/01/27
Stochastic Wire-Length Model with TSV Placement on Periphery Area
会议论文
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, 新加坡
作者:
Ling, Jianhui
;
Li, Huiyun
;
Xu, Guoqing
;
Xiong, Liying
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  |  
浏览/下载:17/0
  |  
提交时间:2015/09/01
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