| A low-pass filter made up of the cylindrical through-silicon-via | |
| Wang, Fengjuan; Huang, Jia; Yu, Ningmei | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | Three-dimensional integrated circuits (3D IC) through-silicon-via (TSV) low-pass filter |
| 页码 | 257-259 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000450155700057 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4972606 |
| 专题 | 西安理工大学 |
| 推荐引用方式 GB/T 7714 | Wang, Fengjuan,Huang, Jia,Yu, Ningmei. A low-pass filter made up of the cylindrical through-silicon-via[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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