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科研机构
上海硅酸盐研究所 [24]
武汉理工大学 [19]
重庆大学 [11]
广州能源研究所 [10]
厦门大学 [9]
西安交通大学 [9]
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期刊论文 [162]
会议论文 [19]
学位论文 [7]
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Study on heat transfer coupling mechanism of direct thermoelectric conversion with regenerative cooling for supersonic combustor applications
期刊论文
APPLIED THERMAL ENGINEERING, 2024, 卷号: 238, 页码: 15
作者:
Gao EK(高尔康)
;
Zhong FQ(仲峰泉)
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2024/02/26
Direct thermoelectric conversion
Regenerative cooling
Supersonic combustor
Analytical model
Genetic algorithm
Efficient Thermoelectric Conversion of Sulfide Chimneys in Submarine Volcanic Systems
期刊论文
EARTH AND SPACE SCIENCE, 2024, 卷号: 11, 期号: 1, 页码: 11
作者:
Jia, Haoning
;
Zhu, Jiaqi
;
Li, Yanzhang
;
Li, Jiwei
;
Ye, Huan
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  |  
浏览/下载:10/0
  |  
提交时间:2024/02/06
Amplification of oxidative damage using near-infrared II-mediated photothermal/thermocatalytic effects for periodontitis treatment
期刊论文
Acta Biomaterialia, 2023, 卷号: 171, 页码: 519-531
作者:
X. Dai, Y. Liu, F. Meng, Q. Li, F. Wu, J. Yuan, H. Chen, H. Lv, Y. Zhou and Y. Chang
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  |  
浏览/下载:0/0
  |  
提交时间:2024/07/02
4 μm Waveband Widely Tunable External Cavity Quantum Cascade Laser
期刊论文
Zhongguo Jiguang/Chinese Journal of Lasers, 2023, 卷号: 50, 期号: 11
作者:
Y. Ma, H. Wu, Z. Li, J. Zhang, X. Zhang, C. Chen, Y. Ning, Y. Qu, H. Peng, L. Qin and L. Wang
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  |  
浏览/下载:1/0
  |  
提交时间:2024/07/04
The controllable electronic characteristics and Schottky barrier of graphene/GaP heterostructure via interlayer coupling and in-plane strain
期刊论文
Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 2022, 卷号: 284
作者:
Lu, Xuefeng
;
Li, Lingxia
;
Guo, Xin
;
Ren, Junqiang
;
Xue, Hongtao
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  |  
浏览/下载:20/0
  |  
提交时间:2022/08/09
Binding energy
Calculations
Gallium compounds
Graphene
Ground state
Heterojunctions
III-V semiconductors
Ohmic contacts
Schottky barrier diodes
Strain
Thermoelectric equipment
Van der Waals forces
Electronic characteristics
Graphene/GaP
In-plane strains
Interlayer coupling
Layer-spacing
Micro/nano
Nanoelectronic devices
P-type
Schottky barriers
Schottky contacts
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
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  |  
浏览/下载:22/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Ultrafast photothermoelectric effect in Dirac semimetallic Cd3As2 revealed by terahertz emission
期刊论文
Nature Communications, 2022, 卷号: 13, 期号: 1, 页码: 9
作者:
W. Lu
;
Z. P. Fan
;
Y. K. Yang
;
J. C. Ma
;
J. W. Lai
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  |  
浏览/下载:10/0
  |  
提交时间:2023/06/14
Electrical energy storage from a combined energy process based on solid oxide fuel cell and use of waste heat
期刊论文
SUSTAINABLE ENERGY TECHNOLOGIES AND ASSESSMENTS, 2021, 卷号: 48
作者:
Lin, Guanwu
;
Wang, Xiaolan
;
Rezazadeh, Ali
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  |  
浏览/下载:13/0
  |  
提交时间:2021/12/17
Electrical energy storage system
Combined energy process
Solid oxide fuel cell
Waste heat
Thermionic and thermoelectric generators
Lattice Strain Leads to High Thermoelectric Performance in Polycrystalline SnSe
期刊论文
ACS NANO, 2021, 卷号: 15
作者:
Lou, Xunuo
;
Li, Shuang
;
Chen, Xiang
;
Zhang, Qingtang
;
Deng, Houquan
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  |  
浏览/下载:32/0
  |  
提交时间:2021/08/31
lattice strain
thermoelectric materials
polycrystalline SnSe
lattice thermal conductivity
figure of merit
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
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  |  
浏览/下载:20/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion barriers
Gold
Gold compounds
Heat resistance
Microstructure
Nickel
Open circuit voltage
Soldering
Barrier films
Diffusion barrier films
Electrical resistances
Output current
Reflow--soldering
Solder joints
Temperature differences
Thermoelectric
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