中国开放科研知识云: 检索

验证码:

换一张

忘记密码？记住我

取消登录

CORC

首页
科研机构
检索
知识图谱
申请加入
托管服务

在结果中检索

科研机构

金属研究所 [8]

厦门大学 [6]

北京大学 [3]

兰州理工大学 [2]

力学研究所 [1]

过程工程研究所 [1]

内容类型

期刊论文 [21]

发表日期

知识图谱

CORC

已提交作品

待认领作品

已认领作品

未提交全文

浏览/检索结果: 共21条，第1-10条

帮助

已选(0)清除条数/页：排序方式：
	Experimental investigation on compressive dwell fatigue behavior of titanium alloy pressure hull for deep-sea manned submersibles 期刊论文 OCEAN ENGINEERING, 2024, 卷号: 303, 页码: 14 作者: Wang, Lei; Ye, Cong; Sun, Chengqi; Feng, Shichao; Xie, Xiaozhong 收藏 \| 浏览/下载：8/0 \| 提交时间：2024/06/17 Compressive dwell fatigue Pressure hull Deep-sea manned submersible Time -dependent strain accumulation Titanium alloy
	First-principles modeling of the hydrogen evolution reaction and its application in electrochemical corrosion of Mg 期刊论文 ACTA MATERIALIA, 2020, 卷号: 183, 页码: 377-389 作者: Ma, Hui; Wu, Liping; Liu, Chen; Liu, Mingfeng; Wang, Changgang 收藏 \| 浏览/下载：22/0 \| 提交时间：2021/02/02 Electrochemical corrosion First-principles modeling Hydrogen evolution reaction Anodic dissolution reaction Mg-based alloys
	Properties and Microstructures of Sn-Bi-X Lead-Free Solders 期刊论文 ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2016, 页码: 15 作者: Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su-juan; Ma, Jia 收藏 \| 浏览/下载：4/0 \| 提交时间：2021/02/02
	Interface reaction in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti solder foil 期刊论文 Journal of Materials Processing Technology, 2015, 卷号: 221, 页码: 285-290 作者: Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xin-Ya; Liu, Min-Pen; Shi, Wei-Gang 收藏 \| 浏览/下载：0/0 \| 提交时间：2022/02/17 Aluminum Atoms Brazing Graphite Lead-free solders Phase interfaces Silver alloys Surface tension Ternary alloys Tin alloys Titanium Titanium alloys Ultrasonic effects Ultrasonic waves Active solder Atmospheric conditions Brazing temperature Formation mechanism Interaction Interface reactions Substitutional solid solutions Ultrasonic vibration
	Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder 期刊论文 Surface Review and Letters, 2015, 卷号: 22, 期号: 3 作者: Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xin-Ya; Shao, Jia-Lin; Liu, Min-Pen 收藏 \| 浏览/下载：4/0 \| 提交时间：2020/11/14 Aluminum Atmospheric temperature Brazing Graphite Lead-free solders Liquids Oxides Silver alloys Silver oxides Ternary alloys Tin alloys Titanium alloys Titanium dioxide Ultrasonic effects Ultrasonic waves Active brazing Ambient conditions Atmospheric conditions Brazing temperature Decomposition temperature Pure aluminum Ultrasonic vibration Wetting and spreading
	Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2012 Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏 \| 浏览/下载：2/0 \| 提交时间：2015/11/12 Surfaces and interfaces Intermetallics Metals and alloys Scanning electron microscopy (SEM) Microstructure LEAD-FREE SOLDERS SN-AG-CU SURFACE-TENSION MOLTEN SILICON WETTABILITY SUBSTRATE ALLOYS DYNAMICS SYSTEMS AL
	Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate 期刊论文科学通报英文版, 2012 Zang LiKun; Yuan ZhangFu; Zhan YaPeng; Wang ChenYu; Xu BingSheng 收藏 \| 浏览/下载：4/0 \| 提交时间：2015/11/12 molten metal and alloys Pb-free solder sessile drop method kinetics electronic materials SURFACE-TENSION WETTABILITY INTERFACE DYNAMICS SYSTEMS AL
	Effect of Alloy Insert on Channel Segregation During Solidification of Sn-10 wt pct Bi Alloy 期刊论文 Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2011, 卷号: 42, 期号: 1, 页码: 210-223 D. R. Liu; B. G. Sang; X. H. Kang; D. Z. Li 收藏 \| 浏览/下载：25/0 \| 提交时间：2012/04/13 nickel-base superalloy pb-sn alloys directional solidification melting behavior macrosegregation ingots convection scheme models liquid
	Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates 期刊论文 COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2010, 卷号: 359, 期号: 1-3, 页码: 1-5 作者: Xu, Hongyan; Yuan, Zhangfu; Lee, Joonho; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏 \| 浏览/下载：16/0 \| 提交时间：2013/11/19 Contour evolution Contact angle Sliding behavior Tilting substrate Interaction
	Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2010 Xu, Hongyan; Yuan, Zhangfu; Lee, Joonho; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏 \| 浏览/下载：3/0 \| 提交时间：2015/11/10 Contour evolution Contact angle Sliding behavior Tilting substrate Interaction CONTACT-ANGLE HYSTERESIS HYDROPHOBIC SURFACES SOLDERING MATERIALS TILTED PLATE LIQUID-DROPS WETTABILITY DROPLETS ALLOYS

相关链接
欧盟学术资源开放存取平台
CALIS高校机构知识库
台湾学术机构典藏
香港机构知识库整合系统
中国科学院机构知识库网格系统

CORC
关于我们
服务条款
隐私条款

联系我们
0931-8270076
cspace@llas.ac.cn
China-OR

中文简体

©版权所有 ©2017 CSpace - Powered by CSpace