Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates

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	Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates
	Xu, Hongyan 1,2,3; Yuan, Zhangfu 1,2; Lee, Joonho 4; Matsuura, Hiroyuki 5; Tsukihashi, Fumitaka 5
刊名	COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
	2010-04-20
卷号	359 期号:1-3 页码:1-5
关键词	Contour evolution Contact angle Sliding behavior Tilting substrate Interaction
ISSN号	0927-7757
通讯作者	Yuan, ZF
英文摘要	The contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed. (C) 2010 Elsevier B.V. All rights reserved.
WOS标题词	Science & Technology ; Physical Sciences
类目[WOS]	Chemistry, Physical
研究领域[WOS]	Chemistry
关键词[WOS]	CONTACT-ANGLE HYSTERESIS ; HYDROPHOBIC SURFACES ; SOLDERING MATERIALS ; TILTED PLATE ; LIQUID-DROPS ; WETTABILITY ; DROPLETS ; ALLOYS
收录类别	SCI
语种	英语
WOS记录号	WOS:000276599900001
公开日期	2013-11-19
内容类型	期刊论文
版本	出版稿
源URL	[http://ir.ipe.ac.cn/handle/122111/6167]
专题	过程工程研究所_多相复杂系统国家重点实验室
作者单位	1.Peking Univ, Dept Energy & Resources Engn, Coll Engn, Beijing 100871, Peoples R China 2.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China 3.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China 4.Korea Univ, Dept Mat Sci & Engn, Seoul 136713, South Korea 5.Univ Tokyo, Dept Adv Mat Sci, Grad Sch Frontier Sci, Chiba 2778561, Japan
推荐引用方式 GB/T 7714	Xu, Hongyan,Yuan, Zhangfu,Lee, Joonho,et al. Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates[J]. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,2010,359(1-3):1-5.
APA	Xu, Hongyan,Yuan, Zhangfu,Lee, Joonho,Matsuura, Hiroyuki,&Tsukihashi, Fumitaka.(2010).Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates.COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,359(1-3),1-5.
MLA	Xu, Hongyan,et al."Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates".COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 359.1-3(2010):1-5.