CORC

在结果中检索

CORC

浏览/检索结果: 共164条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：21/0  |  提交时间：2022/08/22
Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：88/0  |  提交时间：2022/07/19
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin
收藏  |  浏览/下载：28/0  |  提交时间：2022/03/01
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei
收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17
直流电作用下铜在液态锡里的溶解动力学 期刊论文
稀有金属材料与工程, 2020, 期号: 2020-10, 页码: 3425-3432
作者:  孙学敏;  俞伟元;  吴保磊;  杨国庆;  刘赟
收藏  |  浏览/下载：4/0  |  提交时间：2020/12/18

©版权所有 ©2017 CSpace - Powered by CSpace