Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

doi:10.3390/ma15144756

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	Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
	Zhang, Sinan 4; Wang Z(王臻)3; Wang, Jie 2; Duan GH(段桂花)3; Li, Haixia 1
刊名	MATERIALS
	2022-07-01
卷号	15 期号:14 页码:20
关键词	Cu/SAC305/Cu solder joints in situ tensile test fracture analysis X-ray mu-CT FE simulation
DOI	10.3390/ma15144756
通讯作者	Wang, Zhen(zhenwang@imech.ac.cn)
英文摘要	The fracture behavior of the Cu/Sn-3.0Ag-0.5Sn (SAC305)/Cu solder joint was investigated by conducting tensile tests with in situ X-ray micro-computed tomography (mu-CT) observation, and finite element (FE) simulation. The tensile fracture process of solder joints with a real internal defect structure was simulated and compared with the experimental results in terms of defect distribution and fracture path. Additionally, the stress distribution around the defects during the tensile process was calculated. The experimental results reveal that the pores near the intermetallic compound (IMC) layers and the flaky cracks inside the solder significantly affected the crack path. The aggregation degree of the spherical pores and the angle between the crack surface and the loading direction controlled the initiation position and propagation path of the cracks. The fracture morphology indicates that the fracture of the IMC layer was brittle, while the solder fracture exhibited ductile tearing. There are significant differences in the fracture morphology under tensile and shear loading.
分类号	二类
资助项目	National Natural Science Foundation of China[12172367]
WOS关键词	VOID MORPHOLOGY ; SIZE ; DEFORMATION ; INTERFACE ; EVOLUTION ; TEMPERATURE ; SIMULATION ; STRENGTH ; FATIGUE
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics
语种	英语
WOS记录号	WOS:000832281200001
资助机构	National Natural Science Foundation of China
其他责任者	Wang, Zhen
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/89803]
专题	力学研究所_非线性力学国家重点实验室
作者单位	1.Chinese Acad Sci, Inst Proc Engn, Beijing 100190, Peoples R China 2.Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China; 3.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100190, Peoples R China; 4.Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China;
推荐引用方式 GB/T 7714	Zhang, Sinan,Wang Z,Wang, Jie,et al. Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint[J]. MATERIALS,2022,15(14):20.
APA	Zhang, Sinan,王臻,Wang, Jie,段桂花,&Li, Haixia.(2022).Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint.MATERIALS,15(14),20.
MLA	Zhang, Sinan,et al."Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint".MATERIALS 15.14(2022):20.