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浏览/检索结果: 共17条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on Probabilistic Failure Physical Model of BGA Solder Joints in Multiple Fields Coupling 会议论文 2018 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-CHONGQING 2018), 2018-01-01 作者:  Li, Sufen;  Sun, Yufeng;  Li, Xiaoxiao 收藏  |  浏览/下载：15/0  |  提交时间：2019/12/30 BGA solder joint  creep damage model  fatigue damage model  coupling failure physical model  probabilistic failure physical model   A Fatigue Life Model of BGA Solder Joints based on Energy 会议论文 PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING (ICRSE 2017), 2017-01-01 作者:  Liu, Jiamin;  Hu, Weiwei;  Chen, Hao;  Wang, Jiuxing 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 BGA solder joints  thermal fatigue  accelerated test  simulation  life prediction   A fatigue life model of BGA solder joints based on energy 会议论文 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Huairou, Beijing, China, 2017-07-10 作者:  Liu, Jiamin;  Hu, Weiwei;  Chen, Hao;  Wang, Jiuxing 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：12/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Thermal deformation analysis of BGA package by digital image correlation technique 期刊论文 microelectronics international, 2005 Zhang, F; Li, M; Xiong, CY; Fang, F; Yi, S 收藏  |  浏览/下载：7/0  |  提交时间：2015/11/13 stress (materials)  deformation  electronics industry  packaging   板级电子封装跌落/冲击中焊点应力分析 期刊论文 秦飞; 白洁; 安彤 收藏  |  浏览/下载：0/0 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zhou, Min-Bo[1];  Zeng, Jing-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15