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科研机构
上海大学 [22]
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期刊论文 [19]
会议论文 [3]
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2019 [2]
2018 [1]
2017 [3]
2016 [1]
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专题:上海大学
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Preparation of ellipsoidal rod-shaped silica nanocomposite abrasives by Chromium ion/PEG200 induced method for sapphire substrates chemical mechanical polishing
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 777, 页码: 1294-1303
作者:
Dong, Yue[1]
;
Lei, Hong[2]
;
Liu, Wenqing[3]
;
Chen, Yi[4]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/22
Ellipsoidal rod-shaped silica nanocomposite abrasives
Chemical mechanical polishing
Polishing mechanism
Sapphire substrates
Highly efficient removal of sapphire by composite nanoabrasive with novel inorganic polyelectrolyte as a binder
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 782, 页码: 709-715
作者:
Wang, Tianxian[1]
;
Lei, Hong[2]
;
Dong, Yue[3]
;
Xu, Lei[4]
;
Dai, Sanwei[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/22
Novel inorganic polyelectrolyte
Composite abrasive
Chemical mechanical polishing
High material removal rate
Mechanism
Sapphire
Preparation of -alumina/silica core-shell abrasives and their chemical mechanical polishing performances on sapphire substrates
期刊论文
MICRO & NANO LETTERS, 2018, 卷号: 13, 页码: 1315-1320
作者:
Wang, Xin[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/22
scanning electron microscopy
abrasives
surface roughness
friction
X-ray photoelectron spectra
abrasion
secondary ion mass spectra
silicon compounds
alumina
transmission electron microscopy
chemical mechanical polishing
composite materials
materials preparation
time of flight mass spectra
surface morphology
sapphire
core-shell structure
time-of-flight secondary ion mass spectroscopy
scanning electron microscopy
transmission electron microscopy
sapphire substrates
che
Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire
期刊论文
FRICTION, 2017, 卷号: 5, 页码: 429-436
作者:
Zhang, Baichun[1]
;
Lei, Hong[2]
;
Chen, Yi[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/24
chemical mechanical polishing
Ag-doped colloidal silica abrasive
sapphire
material removal rate
CMP behavior of alumina/metatitanic acid core-shell abrasives on sapphire substrates
期刊论文
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2017, 卷号: 50, 页码: 263-268
作者:
Wang, Xin[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/24
Chemical mechanical polishing (CMP)
alpha-Al2O3/TiO(OH)(2) core-shell abrasives
Sapphire
Mechanism
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
期刊论文
APPLIED SURFACE SCIENCE, 2017, 卷号: 413, 页码: 16-26
作者:
Liu, Tingting[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/24
Nd3+-doped colloidal SiO2 composite abrasives
Chemical mechanical polishing (CMP)
Sapphire
Material removal rate (MRR)
Preparation of Mg-Doped Colloidal Silica Abrasives and Their Chemical Mechanical Polishing Performances on Sapphire
期刊论文
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 卷号: 16, 页码: 9951-9957
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/26
Chemical Mechanical Polishing (CMP)
Sapphire
Mg-Doped Colloidal Silica Abrasives
Material Removal Rate
Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire
期刊论文
MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 657-661
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/30
silicon compounds
cobalt
abrasives
time of flight mass spectra
secondary ion mass spectra
scanning electron microscopy
chemical mechanical polishing
surface roughness
atomic emission spectroscopy
X-ray photoelectron spectra
cobalt-doped colloidal silica abrasives
chemical mechanical polishing
seed-induced growth
time-of-flight secondary ion mass spectroscopy
scanning electron microscopy
CMP
sapphire substrates
surface roughness
material removal rate
inductively couple
Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate
期刊论文
MICROELECTRONIC ENGINEERING, 2014, 卷号: 116, 页码: 11-16
作者:
Huang, Liqin[1]
;
Wang, Zhijun[2]
;
Lei, Hong[3]
;
Chen, Ruling[4]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/30
Chemical mechanical polishing (CMP)
Porous alumina-g-polystyrene sulfonic acid abrasive
Hard disk substrate
Planarization
Study of material removal processes of the crystal silicon substrate covered by an oxide film under a silica cluster impact: Molecular dynamics simulation
期刊论文
APPLIED SURFACE SCIENCE, 2014, 卷号: 305, 页码: 609-616
作者:
Chen, Ruling[1]
;
Wu, Yihua[2]
;
Lei, Hong[3]
;
Jiang, Ranran[4]
;
Liang, Min[5]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/30
Material removal mechanism
Crystalline silicon substrate
Oxide film
Impact
Molecular dynamics simulation
Chemical mechanical polishing
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