Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers | |
Liu, Tingting[1]; Lei, Hong[2] | |
刊名 | APPLIED SURFACE SCIENCE |
2017 | |
卷号 | 413页码:16-26 |
关键词 | Nd3+-doped colloidal SiO2 composite abrasives Chemical mechanical polishing (CMP) Sapphire Material removal rate (MRR) |
ISSN号 | 0169-4332 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2190720 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. |
推荐引用方式 GB/T 7714 | Liu, Tingting[1],Lei, Hong[2]. Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers[J]. APPLIED SURFACE SCIENCE,2017,413:16-26. |
APA | Liu, Tingting[1],&Lei, Hong[2].(2017).Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers.APPLIED SURFACE SCIENCE,413,16-26. |
MLA | Liu, Tingting[1],et al."Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers".APPLIED SURFACE SCIENCE 413(2017):16-26. |
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