CORC

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Accuracy Analysis of a 3-DOF Mechanism with Joint Clearances Under Different Working Modes (CPCI-S收录) 会议
作者:  Zhang, Xuchong[1];  Zhang, Xianmin[2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Elastodynamics of a Rigid-Flexible 3-(R)under-barRR Mechanism with Joint Clearances (CPCI-S收录) 会议
作者:  Zhang, Xuchong[1];  Zhang, Xianmin[2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
An estimation method of the direct benefit of a waterlogging control project applicable to the changing environment (CPCI-S收录) 会议
作者:  Liu Zengmei[1,2];  Qin Guanghua[2];  Chen Zishen[3]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议
作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Deterministic Learning for Human Gait Recognition (CPCI-S收录) 会议
作者:  Yang, Feifei[1];  Si, Wenjie[2];  Zeng, Wei[3];  Wang, Qian[4]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议
作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议
作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议
作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Hip, Knee and Ankle Motion Angle Detection Based on Inertial Sensor (CPCI-S收录) 会议
作者:  Sun, Tongyang[1];  Liu, Qihong[1];  Li, Weiguang[1];  Lu, Zhijiang[1];  Chen, Haoqiu[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议
作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/11


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