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| Accuracy Analysis of a 3-DOF Mechanism with Joint Clearances Under Different Working Modes (CPCI-S收录) 会议 作者: Zhang, Xuchong[1]; Zhang, Xianmin[2]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
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| Elastodynamics of a Rigid-Flexible 3-(R)under-barRR Mechanism with Joint Clearances (CPCI-S收录) 会议 作者: Zhang, Xuchong[1]; Zhang, Xianmin[2]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
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| An estimation method of the direct benefit of a waterlogging control project applicable to the changing environment (CPCI-S收录) 会议 作者: Liu Zengmei[1,2]; Qin Guanghua[2]; Chen Zishen[3]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
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| Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者: Huang, Jia-Qiang[1]; Zhou, Min-Bo[1]; Li, Wang-Yun[1]; Zhang, Xin-Ping[1]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
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| Deterministic Learning for Human Gait Recognition (CPCI-S收录) 会议 作者: Yang, Feifei[1]; Si, Wenjie[2]; Zeng, Wei[3]; Wang, Qian[4]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
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| Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议 作者: Jiang, Han[1]; Liang, Shui-Bao[1]; Yuwen, Hui-Hui[1]; Zhang, Xin-Ping[1]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
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| Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者: Li, Wang-Yun[1]; Cao, Shan-Shan[1]; Zhang, Xin-Ping[1]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
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| Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者: Li, Wang-Yun[1]; Cao, Shan-Shan[1]; Zhang, Xin-Ping[1]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
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| Hip, Knee and Ankle Motion Angle Detection Based on Inertial Sensor (CPCI-S收录) 会议 作者: Sun, Tongyang[1]; Liu, Qihong[1]; Li, Weiguang[1]; Lu, Zhijiang[1]; Chen, Haoqiu[2]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
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| Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者: Huang, Jia-Qiang[1,2]; Zhou, Min-Bo[1]; Li, Wang-Yun[1,2]; Zhang, Xin-Ping[1,2]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:10/0  |  提交时间:2019/04/11
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