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Effect of different coatings on the weldability of Al to steel 会议论文
Tokyo, Japan, July 30, 2018 - August 3, 2018
作者:  Sun, Junhao;  Li, Zhuguo;  Huang, Jian;  Cao, Rui
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15
Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Zhang, Dongxiao;  Liu, Shengfa;  Chen, Zhiwen;  Liu, Li*
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
The Research on Welding Sources and Ni Interlayer Synergy Regulation in Laser-Arc Hybrid Welding of Mg and Al Joints 会议论文
TRANSACTIONS ON INTELLIGENT WELDING MANUFACTURING, VOL I, NO. 1 2017, 2018-01-01
作者:  Wang, Hongyang;  Song, Gang;  Feng, Baoqiang;  Liu, Liming
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

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