Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints | |
Shang, Shengyan; Kunwar, Anil; Wang, Yanfeng; Yao, Jinye; Ma, Haitao; Wang, Yunpeng | |
2018 | |
会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
会议日期 | 2018-01-01 |
关键词 | Nanoparticles Intermetallic compounds Screw dislocation Finite element method Solder |
页码 | 135-140 |
会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3253327 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China. |
推荐引用方式 GB/T 7714 | Shang, Shengyan,Kunwar, Anil,Wang, Yanfeng,et al. Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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