| Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics | |
| Zhang, Dongxiao; Liu, Shengfa; Chen, Zhiwen; Liu, Li* | |
| 2018 | |
| 会议名称 | 19th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | AUG 08-11, 2018 |
| 会议地点 | Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA |
| 关键词 | Transient liquid phase sintering Intermetallic compounds porosity Microstructure evolution |
| 页码 | 593-598 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | WOS:000450155700128 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3395061 |
| 专题 | 武汉理工大学 |
| 作者单位 | 1.[Liu, Li 2.Zhang, Dongxiao 3.Liu, Shengfa] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan, Hubei, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhang, Dongxiao,Liu, Shengfa,Chen, Zhiwen,et al. Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics[C]. 见:19th International Conference on Electronic Packaging Technology (ICEPT). Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA. AUG 08-11, 2018. |
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