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大连理工大学 [10]

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清华大学 [5]

上海大学 [3]

湖南大学 [3]

沈阳自动化研究所 [2]

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会议论文 [32]

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	Investigation of effects of pattern structures arrangement on chemical mechanical polishing process 会议论文 Shanghai, China, March 11, 2018 - March 12, 2018 作者: Wu, Lixiao; Hahn, Sookap; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Chemical mechanical polishing Pressure distribution Semiconductor device manufacture Signal processing Silicon wafers Textile printing Chemical-mechanical polishing process Contact pressure distribution Pattern arrangement Pattern structure Polishing processs Splitting signals
	Design of an ultra-precision CNC chemical mechanical polishing machine and its implementation 会议论文作者: Zhang, Chupeng; Zhao, Huiying; Gu, Yawen; Ban, Xinxing; Jiang, Chunye 收藏 \| 浏览/下载：8/0 \| 提交时间：2019/11/26 Chemical mechanical polishing Tin plate Gas hydrostatic rotary table Ultra-precision machine tool Design principle Diamond tool dressing Kinematic errors Gas hydrostatic linear guideway
	Effects of polishing parameters on the evolution of wafer patterns during Cu CMP 会议论文作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Copper Linear systems Polishing Chemical mechanical polishing(CMP) IC industry Linear system model Pattern density Polishing parameters Selectivity ratio Square waves Wafer patterns
	Effects of polishing parameters on the evolution of 3-D wafer patterns during CMP 会议论文 Shanghai, China, March 19, 2013 - March 21, 2013 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Polishing Pressure distribution Semiconductor device manufacture Silicon wafers Chemical mechanical polishing(CMP) Contact pressure distribution Linear modeling Magnitude spectrum Polishing parameters Polishing processs Polishing time Wafer patterns
	Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior 会议论文 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS), Guilin Univ Elect Technol, Guilin, PEOPLES R CHINA, 2010-11-16 作者: Zhang, Shengfang; Su, Jianxiu; Du, Jiaxi; Kang, Renke 收藏 \| 浏览/下载：3/0 \| 提交时间：2019/12/13 Chemical mechanical polishing material removal mechanism lubrication form boundary lubrication
	An analytical model for contact height and contact pressure in chemical mechanical polishing (CMP) for different pattern structure 会议论文 Shanghai, China, March 18, 2012 - March 19, 2012 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：7/0 \| 提交时间：2020/11/15 Analytical models Chemical analysis Polishing Semiconductor device manufacture Silicon wafers Textile printing Chemical mechanical polishing(CMP) Contact pressures Pattern density Pattern designs Pattern evolution Pattern structure Polishing parameters
	An analytical model of contact pressure caused by 2-D wafer topography in chemical-mechanical polishing process 会议论文 Shanghai, China, March 18, 2012 - March 19, 2012 作者: Wu, Lixiao 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/15 Chemical analysis Geometry Polishing Semiconductor device manufacture Silicon wafers Topography Chemical mechanical polishing(CMP) Chemical-mechanical polishing process Contact pressures Elastic half space Linear time-invariant system Magnitude spectrum Pattern features Wafer topography
	Neural Network Predictive R2R Control to CMP Process 会议论文 2011 4th IEEE International Conference on Computer Science and Information Technology, Chengdu, China, June 10-12, 2011 作者: Wang L(王亮); Hu JT(胡静涛) 收藏 \| 浏览/下载：31/0 \| 提交时间：2012/06/06 chemical mechanical polishing RBF neural network predictive control run-to-run control PSO rolling optimization
	Fuzzy predictive R2R control to CMP process 会议论文 2011 IEEE International Conference on Computer Science and Automation Engineering, CSAE 2011, Shanghai, China, June 10-12, 2011 作者: Wang L(王亮); Hu JT(胡静涛) 收藏 \| 浏览/下载：18/0 \| 提交时间：2012/06/06 Chemical mechanical polishing Clustering algorithms Computer science Controllers Industrial applications Mathematical models Polishing Predictive control systems Semiconductor device manufacture Stripping (removal)
	Preparation of porous alumina abrasives with different morphologies and their chemical mechanical polishing behavior 会议论文 PRODUCT DESIGN AND MANUFACTURING, 2011-10-28 作者: Wu, Xin[1]; Lei, Hong[2]; Chen, Ruling[3] 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/04/30 Chemical mechanical polishing (CMP) Porous alumina abrasives Different morphologies Hard disk substrate Planarization

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