| Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior | |
| Zhang, Shengfang; Su, Jianxiu; Du, Jiaxi; Kang, Renke | |
| 2012 | |
| 会议名称 | 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS) |
| 会议日期 | 2010-11-16 |
| 会议地点 | Guilin Univ Elect Technol, Guilin, PEOPLES R CHINA |
| 关键词 | Chemical mechanical polishing material removal mechanism lubrication form boundary lubrication |
| 页码 | 313-+ |
| 会议录 | 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4671776 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.School of Mechanical Engineering, Dalian Jiaotong University, Dalian 116028, China 2.Henan Institute of Science and Technology, Xinxiang 453003, China 3.Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China |
| 推荐引用方式 GB/T 7714 | Zhang, Shengfang,Su, Jianxiu,Du, Jiaxi,et al. Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior[C]. 见:6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS). Guilin Univ Elect Technol, Guilin, PEOPLES R CHINA. 2010-11-16. |
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