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CORC

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The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Kunwar, Anil;  Ma, Haoran;  Qi, Meng;  Sun, Junhao;  Qu, Lin
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09

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