| Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient | |
| Zhao, Ning; Zhong, Yi; Huang, Mingliang; Ma, Haitao; Dong, Wei | |
| 2016 | |
| 会议名称 | 17th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | 2016-08-16 |
| 会议地点 | Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA |
| 关键词 | Synchrotron radiation Thermomigration Dendrite Interfacial reaction Phase separation |
| 页码 | 264-267 |
| 会议录 | 17th International Conference on Electronic Packaging Technology (ICEPT)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4372256 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Ning,Zhong, Yi,Huang, Mingliang,et al. Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient[C]. 见:17th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA. 2016-08-16. |
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