The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows | |
Ma, H. R.; Li, S.; Yao, M. J.; Wang, Y. P.; Chen, J.; Zhao, N.; Ma, H. T. | |
2017 | |
会议名称 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
会议日期 | 2017-01-01 |
关键词 | cooling rate interface intermetallic compounds growth kinetics SEM Synchrotron Radiation |
页码 | 1323-1326 |
会议录 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3300433 |
专题 | 大连理工大学 |
作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. |
推荐引用方式 GB/T 7714 | Ma, H. R.,Li, S.,Yao, M. J.,et al. The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows[C]. 见:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2017-01-01. |
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