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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 前列腺液的拉曼光谱癌症检测的初步研究 期刊论文 Nanomedicine NBM, 2017, 卷号: 13, 页码: 1051-1059 作者:  Shao, Xiaoguang[1];  Pan, Jiahua[2];  Wang, Yanqing[3];  Zhu, Yinjie[4];  Xu, Fan[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 卷号: 437, 页码: 169-179 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 lead-free solder  interfacial reaction  Cu diffusion  intermetallic compound (IMC)   高温,高湿环境中时效时Sn-Zn基无铅焊点的显微组织演化 期刊论文 中国有色金属学报, 2006, 卷号: 16, 页码: 1177-1183 作者:  Wei, Xi-Cheng[1];  Ju, Guo-Kui[2];  Sun, Peng[3];  Cheng, Zhao-Nian[4];  Shangguan, Dong-Kai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 SnZn基焊料  时效  湿度  显微组织  低周疲劳   Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint 期刊论文 Soldering and Surface Mount Technology, 2006, 卷号: 18, 页码: 4-11 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 finite element analysis  fatigue  joining materials  simulation  solders   Study of interfacial reactions in Sn-3.5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 会议论文 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings 作者:  Chen, Si[1];  Sun, Peng[2];  Liu, Johan[3];  Wei, Xicheng[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 期刊论文 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 卷号: 135, 页码: 134-140 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 lead-free solder  ENIG surface finish  intermetallic compound (IMC)   High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 425, 页码: 191-199 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 lead-free solder  electroless Ni(P)  interfacial reaction  inter-metallic compound (IMC)   Study of interfacial reactions in Sn-3.5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 会议论文 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings 作者:  Chen, Si[1];  Sun, Peng[2];  Liu, Johan[3];  Wei, Xicheng[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Study of interfacial reactions in Sn-3.5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 会议论文 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings 作者:  Chen, Si[1];  Sun, Peng[2];  Liu, Johan[3];  Wei, Xicheng[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10