QQ客服 官方微博 反馈留言

浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Association Among Muscular and Other Fitness Components in Professional-Vocational Students 期刊论文 RESEARCH QUARTERLY FOR EXERCISE AND SPORT, 2017, 卷号: 88 作者:  Huang, Guoyuan[1];  Chen, Dan[2];  Shen, Youqing[3];  Lin, Wentao[4];  Feng, Wei[4] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Formation Control Strategy for a Group of Quadrotors (CPCI-S收录) 会议 作者:  Liu, Shulin[1,2];  Wang, Can[1];  Liang, Guoyuan[1];  Chen, Haoyao[2];  Wu, Xinyu[1,3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Half coupling  multiple quadrotors  formation control  synchronization  fault tolerance   Advanced Failure Analysis Techniques for SiP Defect Location and Mechanism Analysis (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Lin, Na[1];  Chen, Yuan;  Li, Guoyuan[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 SiP  failure analysis  defect location  3D X-ray  LIT  FIB   Advanced failure analysis techniques for SiP defect location and mechanism analysis (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Lin, Na[1,2];  Chen, Yuan[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Defects  Electronics packaging  Three dimensional  X ray microscopes  X rays   Design and Simulation of Testing Circuit for Radio Frequency Chip (CPCI-S收录) 会议论文 APPLIED MATERIALS AND TECHNOLOGIES FOR MODERN MANUFACTURING, PTS 1-4 作者:  Luo, Qing[1];  Chen, Hui;  Li, Guoyuan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Radio Frequency (RF)  Integrated Circuit (IC) testing  Automatic Test Equipment (ATE)  impedance matching   Effects of dopants on wettability and microstructure evolution of lead-free solder joints (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Chen, Qiang[1];  Li, Guoyuan[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16 Electronics packaging  Microstructure  Packaging  Soldered joints  Soldering alloys  Tin  Yttrium   Thermal Stress Analysis and Optimization for a Power Controller SiP Module (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Li Zhibo[1,2];  Chu Huabin[2];  Chen Supeng[2];  Li Guoyuan[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16 Thermal stress analysis and optimization for a power controller SiP module (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Li, Zhibo[1,2];  Chu, Huabin[2];  Chen, Supeng[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16 Dies  Electric load forecasting  Electronics packaging  Finite element method  Internet protocols  Optimization  Packaging  Power control  Stress analysis   Effects of Dopants on Wettability and Microstructure Evolution of Lead-Free solder joints (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Chen, Qiang[1];  Li, Guoyuan[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16