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	Thermal stress analysis and optimization for a power controller SiP module (EI收录)
	Li, Zhibo[1,2]; Chu, Huabin[2]; Chen, Supeng[2]; Li, Guoyuan[1]
会议名称	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
会议日期	August 16, 2010 - August 19, 2010
会议地点	Xi'an, China
关键词	Dies Electric load forecasting Electronics packaging Finite element method Internet protocols Optimization Packaging Power control Stress analysis
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2064615
专题	华南理工大学
作者单位	1.[1] School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] Guangdong Yuejing High Technology Co. Ltd., Guangzhou 510663, China
推荐引用方式 GB/T 7714	Li, Zhibo[1,2],Chu, Huabin[2],Chen, Supeng[2],等. Thermal stress analysis and optimization for a power controller SiP module (EI收录)[C]. 见:Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Xi'an, China. August 16, 2010 - August 19, 2010.

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