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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：期刊论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach 期刊论文 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 卷号: 16, 页码: 633-639 作者:  Yue, Cong[1];  Zhang, Yan[2];  Hu, Zhili[3];  Liu, Johan[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 卷号: 437, 页码: 169-179 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 lead-free solder  interfacial reaction  Cu diffusion  intermetallic compound (IMC)   Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint 期刊论文 Soldering and Surface Mount Technology, 2006, 卷号: 18, 页码: 4-11 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 finite element analysis  fatigue  joining materials  simulation  solders   Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 期刊论文 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 卷号: 135, 页码: 134-140 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 lead-free solder  ENIG surface finish  intermetallic compound (IMC)   High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 425, 页码: 191-199 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 lead-free solder  electroless Ni(P)  interfacial reaction  inter-metallic compound (IMC)