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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Multi-variable Time Series Forecasting for Thermal Load of Air-conditioning system on SVR (CPCI-S收录) 会议 作者:  Zhou Xuan[1,2];  Liu Qing-dian[1,2];  Liu Guo-qiang[1,2];  Yan Jun-wei[1,2];  Yang Jian-cheng[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 thermal load of air conditioning system  Support Vector Regression  multi-variable time series forecasting method  Particle Swarm Optimization (PSO) algorithm   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Sneak-path Based Test for 3D Stacked One-Transistor-N-RRAM Array (CPCI-S收录) 会议 作者:  Zhang, Qiang[1];  Cui, Xiaole[1];  Xu, Xiaoyan[1];  Wang, Xin'an[1];  Ma, Zhi[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 RRAM  test technique  sneak-paths  resistance variation   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1,2];  Feng, Jian-Qiang[1,2];  Yue, Wu[3];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 interfacial reaction  intermetallic compound  undercooling dwelling  low temperature soldering   The Relationship between Economic and Social Trust: Taking Four Counties ( Districts) in Guangdong as examples 会议 作者:  Han Yingying[1];  Zhou Tingzhi[1];  Zhang Qiang[2];  Xie Xiaojuan[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Regional economic development  individual income  social trust   Improving methane production during the anaerobic digestion of waste activated sludge: Cao-ultrasonic pretreatment and using different seed s (CPCI-S收录) 会议 作者:  Geng, Yucong[1,2];  Zhang, Bo[3];  Du, Lianzhu[4];  Tang, Zhi[1,2];  Li, Qiang[1,2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Waste activated sludge  anaerobic digestion  Cao-ultrasound pretreatment  seed sludge  methane production   Changes in adipokines in newly diagnosed type 2 diabetes patients treated with exenatide, insulin or pioglitazone (CPCI-S收录) 会议 作者:  Yang, Xubin[1];  Xu, Wen[1];  Zhu, Dalong[2];  Sun Zilin[3];  Guo, Lixin[4] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Adipokines  hypoglycemic agents  diabetes mellitus  type 2   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array