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科研机构
华南理工大学 [9]
内容类型
会议 [9]
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Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录)
会议
作者:
Yue, Wu[1]
;
Zhou, Min-Bo[2,3]
;
Zhang, Xin-Ping[2,3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
laser jet solder ball bonding
Sn-3.0Ag-0.5Cu solder ball
wettability
surface contamination
Millimeter-Wave Image Target Recognition Based on the Combination of Shape Features (CPCI-S收录)
会议
作者:
Dai, Ling[1]
;
Hu, Hong[1]
;
Chen, Yifan[2]
;
Zhou, Min[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Feature extraction
Combined features
Invariants
Target recognition
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Enhancement of the electrochemical performance of CoB amorphous alloy through the addition of A(2)B(7)-type alloy (CPCI-S收录)
会议
作者:
Qiu, Shujun[1,2]
;
Huang, Jianling[1,2]
;
Shen, Feihong[1,2]
;
Pang, Rui[1,2]
;
Chu, Hailiang[1,2,3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Electrochemical properties
Composite
A(2)B(7)-type alloy
CoB alloy
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录)
会议
作者:
Chen, Guo-Liang[1,2]
;
Zhou, Min-Bo[1,2]
;
Zhang, Lang[1,2]
;
Lin, Yuan-Jiang[1,2]
;
Zhang, Yu-Peng[3]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
aluminum soldering
Sn-0.7Cu solder
interfacial microstructure
mechanical property
LED assembly
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录)
会议
作者:
Zhou, Min-Bo[1,2]
;
Feng, Jian-Qiang[1,2]
;
Yue, Wu[3]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
interfacial reaction
intermetallic compound
undercooling dwelling
low temperature soldering
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录)
会议
作者:
Huang, Lia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Sn58Bi
Sn3.0Ag0.5Cu
Mixed solder joint
Microstructure
interfacial reaction
Ball grid array
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